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Executive Infrared Imaging Forum

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FORUM-PAPER-AGENDA-SPEAKER-REGISTRATION-SPONSORSHIP-HOTELS


About the 2nd Executive Infrared Imaging Forum: Uncooled Infrared Imaging for Volume Applications

The 2nd Executive Infrared Imaging Forum organized by Yole Développement and hosted by CIOE will take place on September 7, 2017 in Shenzhen, alongside the 19th China International Optoelectronic Expo 2017. The event presents applications and technologies within the infrared imaging industry.

 

The forum will bring together a worldclass panel of users and application experts and allow participants to get valuable insights into the status and future of the infrared imaging industry as well as provide unprecedented opportunities for meeting with industry leaders.


Sessions will focus on the following applications:

Surveillance-Thermography-Automotive-Consumer-Safety


Highlights from the 1st Executive Infrared Imaging Forum:

● 90+ delegates from Dali, Veeco, Sony, Ophir, Honeywell,i3 system, Fluke, Flir, Melexis, Oxford Instruments Plasma.

● 1 Privilege Sponsor – Ulis

● 3+ hours of networking

● 10 Speakers from Heimann Sensor, Robert Bosch, Umicore, KAIST, Device Alab, Autoliv, Telops, Ulis, INO, Mikrosens.

●  2 Keynotes from Yole Development and Heimann Sensor 


Call for paper

 

Yole Développement and CIOE welcome original submissions in the following range of areas:


Applications:

- Surveillance

- Thermography

- Automotive

- Consumer & Personal Vision Systems

- Safety & firefighting

- Military

- …

New functions:

- Biometry,

- Night vision,

- Motions sensing,

- People counting,

- Spot thermometry,

- Gesture recognition

- …


New technologies:


- Active & passive detection

- Integration and miniaturization,

- Sensor fusion,

- IR optics & lenses,

- Packaging,

- Imaging technologies (micro bolometer, 

thermopile, pyroelectric, CMOS …),

- Camera module,

- Camera architecture,

-  …

Manufacturing processes, materials and equipment:

- Silicon as an optical material, Chalcogenides, Ge …

- Wafer level packaging,

- Wafer level optics,

- Wafer level testing,

- New detection material,

- New manufacturing processes,

- Roadmapping

- Functional test,



Please submit abstract (200 words max.) to Derek Deng (derek.deng@cioe.cn) by May 10, 2017. Your abstract can include one or two illustrations (graph, images…).


GUIDELINES FOR PAPER SUBMISSION.


Agenda

 


The Agenda is coming soon. 


REGISTRATION 


Early bird rate( before August 5): EUR 215(1600 RMB);

Standard rate (after August 5): EUR 265 (2000 RMB).

If you are interested in attending this forum, please register here, or download registeration form.


Note: The ticket will include participation, forum documents, translation, speakers’ PPT file, lunch, and tea break, cocktail etc.

For any questions, email Shirly Yi  (Shirly.yi@cioe.cn) or Derek Deng (derek.deng@cioe.cn).

 

SPONSORSHIP OPPORTUNITIES 

 

The 2nd Executive Infrared Imaging Forum: Uncooled Infrared Imaging for Volume Applications will provide timely, comprehensive coverage of infrared imaging industry. If you are looking for increased visibility, new business development (...) or any combination, the forum enables you to develop and highlight your brand towards a key audience. More information, please refer to the sponsorship opportunities!


HOTELS

 

Find a list of hotel near the convention center here

More information or any question, please contact Shirly Yi  (Shirly.yi@cioe.cn) or Derek Deng (derek.deng@cioe.cn).

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