About the 2nd Executive Infrared Imaging Forum: Uncooled Infrared Imaging for Volume Applications
The 2nd Executive Infrared Imaging Forum organized by Yole Développement and hosted by CIOE will take place on September 7, 2017 in Shenzhen, alongside the 19th China International Optoelectronic Expo 2017. The event presents applications and technologies within the infrared imaging industry.
The forum will bring together a worldclass panel of users and application experts and allow participants to get valuable insights into the status and future of the infrared imaging industry as well as provide unprecedented opportunities for meeting with industry leaders.
Highlights from the 2nd Executive Infrared Imaging Forum:
● 2 main sessions on Infrared Imaging Applications & Technologies.
● Distinguished speakers from ULIS, Oxford Instruments, Optris, HIK Vision, Heimann Sensors, JIR Infrared, SST Vacuum Reflow Systems, Fraunhofer Institut for Electronic Nano Systems ENAS, Mikrosens, Sunny Optical, Yole Développement.
● 100+ Attendees from famouse infrared brands:
● 3+ hours of networking,
Call for paper
September 7, 2017, SZCEC
Registration / Badge Collection
Welcome and Introduction
Yole Développement and CIOE
Session 1： Applications Session
Uncooled IR Imaging Market Perspectives
Dr. Eric Mounier
State of the art of High End Thermal Image Sensors performances in mass production
The Status and Challenges of Thermal Imaging in Security Applications
Dr. Guo Haixun
Product Director of Thermal Imaging
Progress on low cost Thermopile Arrays for high volume applications – eg. office automation, person detection and thermal imaging
Tea break and networking
New ultra-compact infrared cameras with 500 nm spectral response for metal industry
Head of Product Management
Uncooled Infrared Imaging System for Forest Fire Detection and Monitoring
|Sunny Optical Technologies|
Lunch and Networking
Session 2: New Advances in Infrared Technologies
Ion Beam Deposition of VOx films for uncooled bolometer and thermal sensor applications
Dr David I C Pearson
Ion Beam Senior Technologist,
Oxford Instruments Plasma Technology
Modern Assembly Technology for Packaging of IR Microbolometers
Director of Global Sales
SST Vacuum Reflow Systems
Prospect of commercial chalcogenide glasses used for uncooled infrared imaging system
The Australian National University
MOEMS components with subwavelength structures for hyperspectral imaging
Fraunhofer Institute for Electronic Nano Systems (ENAS)
Tea break and networking
Atomic Layer Deposition of Thin Films for Infrared Applications
|Kari Koski||Technical Sales Manager|
|16:25-16:50||Technologies for Thermal Imaging Packages||Ignace Dupon||Europe/Asia Sales Director||EGIDE|
|16:50-17:15||High-Performance Readout Circuits for Gryogenic & Uncooled IRFPA||Wengao LU||Associate Professor, Deputy Director||Pekin University|
Cocktail and networking
|Click to download the latest agenda.|
Early bird rate( before August 10): EUR 215(1600 RMB)；
Standard rate (after August 10): EUR 265 (2000 RMB).
Note: The ticket will include participation, forum documents, translation, speakers’ PPT file, lunch, and tea break, cocktail etc.
The 2nd Executive Infrared Imaging Forum: Uncooled Infrared Imaging for Volume Applications will provide timely, comprehensive coverage of infrared imaging industry. If you are looking for increased visibility, new business development (...) or any combination, the forum enables you to develop and highlight your brand towards a key audience. More information, please refer to the sponsorship opportunities!
Find a list of hotel near the convention center here